OIS Optical Image Stabilizer lens thickness of 5.08mm, it is the thinnest, and with two ISP chips

remove all the metal shield on the motherboard

ESS ES9018K2M 32-bit Stereo Mobile Audio DAC and TI OPA1612 Operational Amplifier, This set of audio chips is currently the most high-end chips in smartphones

Samsung 3GB RAM + 2.5GHz Qualcomm Snapdragon 801 processor

Qualcomm PM8941 Power management chip

Qualcomm PM8841 Power management chip

dual SIM Card slots, support microSIM card and nanoSIM card

Toshiba 16GB ROM

Qualcomm WCD9320 Audio decoder chip

Qualcomm QFE1100 Envelope Tracking Chip

Qualcomm WTR1625L RF Transceiver, support GPS and China Beidou Navigation Satellite System

AVAGO ACP7600 RF power amplifier

Skyworks 85709-11 5GHZ wifi chip

Qualcomm WCN3680 bluetooth 4.0 chip

 

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